Technical Details
- Series:268
- Package:Bulk
- Part Status:Active
- Type:Wire Solder
- Composition:Sn99.3Cu0.7 (99.3/0.7)
- Diameter:0.040" (1.02mm)
- Melting Point:441°F (227°C)
- Flux Type:No-Clean
- Wire Gauge:18 AWG, 19 SWG
- Process:Lead Free
- Form:Spool, 17.64 oz (500g)
- Shelf Life:-
- Shelf Life Start:-
- Storage/Refrigeration Temperature:50°F ~ 104°F (10°C ~ 40°C)
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