Technical Details
- Series:268
- Package:Spool
- Part Status:Active
- Type:Wire Solder
- Composition:Sn63Pb37 (63/37)
- Diameter:0.015" (0.38mm)
- Melting Point:361°F (183°C)
- Flux Type:No-Clean
- Wire Gauge:26 AWG, 27 SWG
- Process:Leaded
- Form:Spool, 17.64 oz (500g)
- Shelf Life:-
- Shelf Life Start:Date of Manufacture
- Storage/Refrigeration Temperature:50°F ~ 104°F (10°C ~ 40°C)
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