Technical Details
- Series:268
- Package:Spool
- Part Status:Active
- Type:Wire Solder
- Composition:Sn96.5Ag3Cu0.5 (96.5/3/0.5)
- Diameter:0.010" (0.25mm)
- Melting Point:423 ~ 424°F (217 ~ 218°C)
- Flux Type:No-Clean
- Wire Gauge:30 AWG, 33 SWG
- Process:Lead Free
- Form:-
- Shelf Life:-
- Shelf Life Start:Date of Manufacture
- Storage/Refrigeration Temperature:50°F ~ 104°F (10°C ~ 40°C)
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