Technical Details
- Series:245
- Package:Bulk
- Part Status:Active
- Type:Wire Solder
- Composition:Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
- Diameter:0.025" (0.64mm)
- Melting Point:423°F (217°C)
- Flux Type:No-Clean
- Wire Gauge:22 AWG, 23 SWG
- Process:Lead Free
- Form:Spool, 17.64 oz (500g)
- Shelf Life:-
- Shelf Life Start:-
- Storage/Refrigeration Temperature:50°F ~ 104°F (10°C ~ 40°C)
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