In Stock: 2,716

Can ship immediately

Pricing:

Call for price or sumbit a RFQ

Technical Details

  • Series:500
  • Package:Bulk
  • Part Status:Active
  • Type:DIP, 0.4" (10.16mm) Row Spacing
  • Number of Positions or Pins (Grid):8 (2 x 4)
  • Pitch - Mating:0.100" (2.54mm)
  • Contact Finish - Mating:Gold
  • Contact Finish Thickness - Mating:20.0µin (0.51µm)
  • Contact Material - Mating:Beryllium Copper

 

  • Mounting Type:Through Hole
  • Features:Closed Frame
  • Termination:Solder
  • Pitch - Post:0.100" (2.54mm)
  • Contact Finish - Post:Gold
  • Contact Finish Thickness - Post:47.2µin (1.20µm)
  • Contact Material - Post:Copper Alloy
  • Housing Material:Thermoplastic, Polyester
  • Operating Temperature:-55°C ~ 105°C

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