In Stock: 2,749

Can ship immediately

Pricing:
  • 1$36.40198
  • 15$36.40198

Technical Details

  • Series:558
  • Package:Bulk
  • Part Status:Active
  • Type:BGA
  • Number of Positions or Pins (Grid):352 (26 x 26)
  • Pitch - Mating:0.050" (1.27mm)
  • Contact Finish - Mating:Gold
  • Contact Finish Thickness - Mating:10.0µin (0.25µm)
  • Contact Material - Mating:Brass

 

  • Mounting Type:Surface Mount
  • Features:Closed Frame
  • Termination:Solder
  • Pitch - Post:0.050" (1.27mm)
  • Contact Finish - Post:Gold
  • Contact Finish Thickness - Post:10.0µin (0.25µm)
  • Contact Material - Post:Brass
  • Housing Material:FR4 Epoxy Glass
  • Operating Temperature:-55°C ~ 125°C

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